Proprietary thermal conductive paste designed to improve heat transfer between the heat source and heat sink. It is intended for normal use for processors, graphics cards, chipsets, memory and more. It also improves the contact of both components and thus helps to reduce the temperature and extend the life of expensive integrated circuits. In addition, the paste is also completely non-conductive, so there is no danger of a short circuit from accidental contact with components.
Note: to be applied in a very thin layer only on the place of direct contact with the cooler chip.