This top heat-conducting paste is made up of a variety of microparticles to ensure that you get the least heat resistance between the processor and the heat sink. It is easy to apply and provides long-term stability. The paste is electrically non-conductive and because of its hybrid composition it does not need time to set or melt after application, providing the best results for all types of cooler (air and water).
Parameters and Specifications:
Amount:1.4ml (for 15 applications)
Maximum: -50°C to +110°C
Recommended: -40°C to +90°C